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Cymbet Teams with Micross to Supply New Embedded Energy Solutions

Micross to Offer EnerChip™ Solid State Batteries in Bare Die Format

Minneapolis, May 7, 2012 - Cymbet Corporation announced today that they are teaming with Micross Components to distribute and package Cymbet’s entire family of EnerChip™ Smart Solid State Batteries and ultra low power management IC solutions in bare die form.  Cymbet’s EnerChips are constructed on silicon wafers using semiconductor processing techniques which make them perfect for co-packaging with other Integrated Circuits carried on the Micross line card.   Energy storage can now be embedded directly into a single miniature multi-chip package. Embedded energy opens up new innovative product capabilities that previously could not be realized with legacy energy storage devices.

“Micross Components is an ideal partner for Cymbet as they specialize in bare die distribution and hi-reliability microelectronics component assembly and integration,” said Bill Priesmeyer Cymbet CEO. “The aim of Micross is to provide a single solution to a customer’s requirements and now they can offer integrated EnerChip batteries that will solve previously unmet needs.”

EnerChips Go Where Batteries and Super Caps Can Not
The EnerChip Solid State batteries have a footprint as small as the CBC005 bare die that is 1.375mm by 0.85mm by 200 microns thick. CBC012 and CBC050 provide more energy storage in similarly small footprints.  In addition, Micross will be offering the CBC910 EnerChip power management IC bare die that provides all the functions listed in the Cymbet EnerChip CC series of products.  Background information on EnerChip bare die can be found at

“We are extraordinarily pleased to have Cymbet as our embedded energy partner,” said Tony Hamby Micross General Manager.  “Combining the EnerChip battery line with the wide range of components that we already offer in die format, enhances our ability to act as a comprehensive IC solutions provider to the high-reliability markets we support—defense, space, medical, oil and energy exploration.”

Evaluate EnerChips as Packaged Parts Before Designing with Bare Die
Cymbet makes it easy to experiment with EnerChip solid state batteries before utilizing bare die by using one of two EnerChip CC evaluation kits:

  • CBC-EVAL-05 EnerChip CC Evaluation Kit contains everything needed to test EnerChip 12uAh and 50uAh thin film batteries, EnerChip CC CBC3112 and CBC3150 batteries with Integrated Battery Management, and multiple batteries in parallel. This kit will also include a CBC3105 evaluation board for experimenting with this tiny 4mm x 5mm packaged device.  Using an EnerChip bare die solution from Micross is an even smaller footprint implementation. 
  • CBC-EVAL-06 Real-Time-Clock Evaluation Kit: includes a Microcrystal NV2123 Real-Time Clock device and a CBC3112 EnerChip CC for battery backup. This kit also includes a Windows based Graphical User Interface to set the clock & test RTC operation in backup and count-down modes.

“Included with all Cymbet evaluation kits are full datasheets and application notes that include reference designs and schematics,” said Steve Grady, VP Marketing at Cymbet. “We provide all the information designers need for easy EnerChip bare die integration into their new products on”  

About Cymbet

Cymbet Corporation is the leader in solid-state energy storage solutions for microelectronic systems. The company is the first to market eco-friendly rechargeable solid-state batteries that provide electronic systems designers with new embedded power capabilities. The company's EnerChip™ devices enable new concepts in energy storage application for ICs and new products for medical, sensor, RFID, industrial control, communications and portable electronic devices. Visit Cymbet online at

About Micross Components

Micross Components is a leading global provider of specialty electronic solutions for defense, space, medical, and demanding industrial applications. Operating as a single source for high-reliability and state of-the-art electronics, Micross’ offerings range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 30+ year heritage, Micross possesses the design, manufacturing, and logistics expertise needed to support an application from start to finish. For more information, visit

For further information:

For Cymbet press enquiries:
Steve Grady, VP Marketing

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