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Products

Image of Cymbet Solid State Batteries

Embedded Energy

Integrate EnerChip™ Bare Die Directly into a Chip or Module

Cymbet EnerChip™ rechargeable solid-state energy batteries are created using semiconductor processing techniques on silicon wafers. EnerChip devices are compatible with other semiconductor integrated circuits and passive devices and can be co-packaged together. EnerChip devices as small as 1mm x 1mm can be coupled with other ICs to create unique innovative products.

Click play arrow to view the EnerChip Embedded Energy video

Embedded Energy Example in a Wireless Intra Ocular Pressure Sensor

The video above describes an examaple of Embedded Energy used to power the Intra Ocular Pressure sensor shown in the photos below. This IOP sensor uses a 1uAh EnerChip CBC001-BDC bare die battery as shown in the second layer in the diagram on the right. For additional details on this device a paper from the University of Michigan can be found here...

Image of University of Michigan Micro Sensor using EnerChip Embedded Energy Image of Wireless Intra Ocular Pressure Sensor
University of Michigan Micro Sensor using EnerChip Embedded Energy

Click here to get a quote for EnerChip bare die batteries and learn more....

EnerChip Bare Die Attachment Mechanisms

Since EnerChip devices are produced like semiconductor devices, they are packaged in the same fashion as other ICs. EnerChip bare die pad attachment may be accomplished with either wire bond or gold solder bump techniques.

EnerChip RTC Uses an Embedded Energy Co-Package

Given the unique structure of EnerChip devices, there are several ways to mount and attach the EnerChip bare die. The traditional method of wire bonding is what Cymbet utilizes in standard EnerChip packaged offerings as it is very reliable and cost effective. Wire bond techniques are shown in the following diagrams in several configurations: Side by Side as shown in the EnerChip RTC, Stacked Die in a "Wedding Cake" configuration, or Stacked Die in a "Waterfall" configuration.

 

 

Click here for the EnerChip Bare Die Datasheet

EnerChip bare die may be processed with gold solder bumps on the attach pads. Bumped EnerChip bare die can then be attached in a package using a flip chip process as shown in the following diagram. Contact Cymbet Applications Energineering for more details.

 

New Embedded Energy Applications

EnerChip rechargeable solid-state energy storage devices are designed for direct integration at the chip level, or as an SMT component. The EnerChip can provide back-up power and energy management functions in a single co-package providing a simple “drop in power” solution with up to 8 weeks of permanent back-up power. Embedded Energy is useful in many industries:

  • Consumer Electronics
  • Industrial Controls
  • Medical Devices
  • Environmental Sensors
  • Hand-held Devices
  • Networking and Communications Systems
  • Security and Tamper Detection
  • Military and Aerospace

Purchase EnerChip Bare Die at Micross

Cymbet has partnered with Micross for distribution of Cymbet bare die products. Please click here or the Micross logo:

Cymbet EnerChip bare die distribution

Please contact Cymbet’s Applications Team directly at support@cymbet.com for assistance with your application.

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